{
  "checkedAt": "2026-10-22T02:34:23.910507+00:00",
  "referenceBoardSha256": "d9ff1151deb55c36f355f1967cd5b3d3d09a6c394cdcebefc71823b60bdf0cdf",
  "candidateBoardSha256": "278c213810aef407ed7b691be2f5ac118874e4c889267b1b8a66316d96d4db5c",
  "nativeKiCadVersion": "10.0.7",
  "experiment": "Remove only the GND through-via at (135,86.3) mm, UUID b564140b-90ff-4142-825a-d8341d7d43f5, from an isolated copy; refill zones and run severity-all DRC.",
  "reference": {
    "violations": 0,
    "unconnectedItems": 0,
    "exclusions": 0
  },
  "candidate": {
    "violations": 0,
    "unconnectedItems": 1,
    "findings": [
      {
        "description": "Missing connection between items",
        "items": [
          {
            "description": "Zone [GND] on B.Cu, priority 1",
            "pos": {
              "x": 48.0,
              "y": 54.579
            },
            "uuid": "0e5ae786-a742-4508-bbc4-c8f544cb631d"
          },
          {
            "description": "Zone [GND] on B.Cu, priority 1",
            "pos": {
              "x": 48.0,
              "y": 54.579
            },
            "uuid": "0e5ae786-a742-4508-bbc4-c8f544cb631d"
          }
        ],
        "severity": "error",
        "type": "unconnected_items"
      }
    ]
  },
  "decision": "Reject simple via deletion: connectivity regresses. Keep production source unchanged.",
  "remainingOptions": [
    "Qualify existing via-in-pad assembly using appropriate stencil/paste, inspection and rework; no guaranteed yield inferred.",
    "Get explicit filled/capped via capability and cost if that process is selected; opposite-side tenting is not equivalent.",
    "Design and independently check a new exposed-pad ground escape rather than deleting the only connection."
  ],
  "limitations": "This experiment proves a native connectivity regression, not a solder-wicking measurement or an assembly failure.",
  "revisionNote": "Historical analysis of pre-0.0.7 layout; not the current Gerber/CPL or a current supplier quote."
}