Drill report for SeedSigner-Plus-smartcard-pico.kicad_pcb
Created on 2026-10-14T23:25:35

Copper Layer Stackup:
    =============================================================
    L1 :  F.Cu                      front
    L2 :  B.Cu                      back


Drill file 'SeedSigner-Plus-smartcard-pico-PTH.drl' contains
    plated through holes:
    =============================================================
    T1  0.300mm  0.0118"  (322 holes))
    T2  0.500mm  0.0197"  (4 holes)  (with 4 slots)
    T3  1.000mm  0.0394"  (64 holes))

    Total plated holes count 390


Drill file 'SeedSigner-Plus-smartcard-pico-NPTH.drl' contains
    unplated through holes:
    =============================================================
    T1  2.200mm  0.0866"  (2 holes))
    T2  2.700mm  0.1063"  (4 holes))

    Total unplated holes count 6
